Thermal engineering

Resistors based on EBG’s thick film technology provide an extremely attractive combination of high electrical load capacity and minimal space requirements, and can also be utilized for high-frequency currents and for pulse applications. EBG was able to improve the performance of the latest generation of UXP resistors to 2,000 W. Thermal engineering is the foundation for achieving the best performance value and service life. EBG’s development efforts also center on the optimization of the entire thermal path extending from the resistor through the thermal interface to the heat sink.

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